0.050 in. Pitch Headers and Receptacles
Description:
Koehlke's 0.050 inch headers and receptacles offer design flexibility for applications wherever there is a need for low profile, high-density compact interconnections.
The 0.050 inch pitch interconnection system consists of through hole or Surface Mount Technology (SMT) headers and Surface Mount Technology receptacles that meet requirements for fine pitch, board-to-board interconnections.
Headers -
The 0.050 inch through hole and SMT headers are offered in two standard pin lengths; 1.52 mm [0.060 in.] and 2.29 mm [0.090 in.]. The 0.406 mm [0.016 in.] square pins are made of high strength copper alloy. The right angle headers are offered in four different pin lengths.
Stacking Headers -
The 0.050 inch stacking headers are offered in three pin lengths. Standard stack heights available range from a minimum of 3.15 mm [0.124 in.] to
9.55 mm [0.376 in.] for 0.787 mm [0.031 in.] boards. The 0.406 mm [0.016 in.] square pins are made of high strength copper alloy.
Receptacles -
The 0.050 inch receptacles utilize SMT and are available in top entry form only. The stamped and formed contacts are beryllium copper.
Typical Applications:
- Digital cellular phones
- Pagers
- Handsets
- Notebook computers
- PDAs
- Compact peripherals
- Portable test and measurement equipment
- Other portable electronic devices
| Performance Characteristics |
Headers |
Stacking Headers |
Receptacles |
| Total No. of Positions |
4 to 30 (straight)
4 to 50 (right angle) |
4 to 30 |
4 to 30 |
| Number of Rows |
2 |
2 |
2 |
| Orientation |
Vertical or right angle (or horizontal) |
Vertical |
Vertical (top entry) |
| Mounting Style |
Through hole or surface mount (SMT) |
Through hole |
Surface mount (SMT) |
| Contact Style |
Stamped and formed |
Stamped and formed |
Stamped and formed |
| Packaging Type (Through Hole) (SMT) |
Bulk or tubes (standard or Tape & Reel) |
Bulk or tubes |
Tubes (standard) or Tape & reel |
| Insulator Material |
High temperature thermoplastic, UL94V-0 |
High temperature thermoplastic, UL94V-0 |
Liquid Crystal Polymer (LCP), UL94V-0 |
| Contact Base Material |
Copper alloy |
Copper alloy |
Beryllium copper |
| Contact Resistance |
20 mΩ max. |
20 mΩ max. |
20 mΩ max. |
| Operating Temperature |
-40°C to +105°C |
-40°C to +105°C |
-40°C to +105°C |
| Durability (Mating Cycles) |
50 cycles |
50 cycles |
50 cycles |
| Mating Force |
6 oz. max. (1.67 N) |
6 oz. max. (1.67 N) |
6 oz. max. (1.67 N) |
| Unmating Force |
0.75 oz. min. (0.21 N) |
0.75 oz. min. (0.21 N) |
0.75 oz. min. (0.21 N) |
| Plating (Contact Area) |
1.27 µm [50 µin.] nickel underplate overall and 0.38 µm [15 µin.] 80/20 palladium nickel with gold flash overall |
1.27 µm [50 µin.] nickel underplate overall and 0.38 µm [15 µin.] 80/20 palladium nickel with gold flash overall |
0.75 µm [30 µin.] nickel underplate overall and 0.25 µm [10 µin.] gold overall |
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