1 mm Pitch Headers and Receptacles
Description:
As electronic designs become increasingly smaller in size, standard interconnect systems become limited in their use. Koehlke's 1mm interconnection system, consisting of Surface Mount Technology (SMT) headers and receptacles, meets the requirement for a fine-pitch, board-to-board interconnect. The 1mm by 1mm grid headers and receptacles offer design flexibility for compact designs.
Headers -
The lmm pitch headers are offered with 0.356 mm [0.014 in.] square pins in three standard pin lengths. The pins are made of high strength copper alloy.
Receptacles -
The 1mm pitch receptacles are available either in a top entry or bottom entry form. Stamped and formed contacts are beryllium copper.
Industry Approvals:
These components have been evaluated by Underwriters Laboratories as recognized components, and are included in UL File E134099. Testing was conducted per the Standard for Component Connectors for use in Data, Signal, Control and Power Applications, UL1977. The components meet the Canadian Standards Association for certification per CSA Std. C22.2 No. 182.3-M1987, and are included in CSA File LR95831.
Typical Applications:
- The lmm pitch headers and receptacles are designed for use in wireless mobile electronics:
- Digital cellular phones
- Pagers and PDAs
- Portable computers
- Handheld electronics
- Any interconnect system that requires low-profile, high-density compact connections
| Performance Characteristics |
Headers |
Receptacles |
| Total No. of Positions |
2 x 2 to 2 x 15, for larger sizes consult factory |
2 x 2 to 2 x 15, for larger sizes consult factory |
| Orientation |
- |
Top entry or bottom entry |
| Mounting Style |
Surface mount (SMT) |
Surface mount (SMT) |
| Contact Style |
Stamped and formed |
Stamped and formed |
| Packaging Type |
Tubes or Tape & reel |
Tubes or Tape & reel |
| Insulator Material |
High temperature thermoplastic, UL94V-0 |
High temperature thermoplastic, UL94V-0 |
| Contact Base Material |
Copper alloy |
Beryllium copper |
| Contact Resistance |
20 mΩ max. initial |
20 mΩ max. initial |
| Operating Temperature |
-55°C to +125°C |
-55°C to +125°C |
| Plating (Contact Area) |
0.25 µm [10 µin.] gold overall* |
0.25 µm [10 µin.] gold overall* |
| Underplating |
1.27 µm [50 µin.] nickel |
1.27 µm [50 µin.] nickel |
| Mating Force |
150 gf max. per contact |
150 gf max. per contact |
| Unmating Force |
10 gf min., 40 gf max. per contact |
10 gf min., 40 gf max. per contact |
*Note: Alternative plating for both headers and receptacles is available upon request, subject to minimum order quantities. Please consult factory.
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